10/26/2006

IBM gives chips a cooling rinse

Filed under: — By Aviran Mordo @ 7:54 am

Researchers develop a system that squirts water over the surface of a processor to cool it–which could promise benefits for server farms.

Researchers at IBM’s Zurich labs have developed a “chip cap” filled with a network of channels that can help capture the heat generated by microprocessors and other semiconductors and transport it somewhere else. The design of the hierarchical channels was inspired by similar branching systems found in nature, said IBM, which disclosed details about the project at the Power and Cooling for Data Centres Summit taking place in London this week.

Source: News.com

 

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